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revisions ltr description date (yr - mo - da) approved a add paragraph 3.1.1 and appendix a for microcircuit die. changes in accordance with n.o.r. 5962 - r168 - 96. 96- 08- 01 r. monnin b make changes to boilerplate and add device class t. - ro 98- 12- 04 r. monnin c drawing updated to reflect current requirements. - gt 03- 01- 06 r. monnin d add device type 04. delete dose rate upset testing. - ro 06- 12- 12 r. monnin e make limit changes to the ?supply voltage between ? v and ground? parameter as specified under paragraph 1.3. - ro 07- 02- 27 j. rodenbeck f add device type 05. - ro 08- 06- 19 r. heber g corrected device types 04 and 05 technology from cmos to bicmos. add bicmos device types 06, 07, and 08. delete latch up data from paragraph 1.5, paragraph 4.4.4.3 dose rate induced latchup testing, and paragraph 4.4.4.4 dose rate burnout . delete table iii and references to device class m requirements. - ro 13- 03- 22 c. saffle rev sheet rev g g g g g g g g g g g g g g sheet 15 16 17 18 19 20 21 22 23 24 25 26 27 28 rev status rev g g g g g g g g g g g g g g of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by sandra rooney dla land and maritime columbus, ohio 43218 - 3990 http://www.landandmaritime.dla.mil standard microcircuit drawing this drawing is available for use by all departments and agencies of the department of defense checked by sandra rooney approved by michael a. frye microcircuit, linear radiation hardened cmos, dual spdt analog switches, monolithic silicon drawing approval date 95- 11- 09 amsc n/a revision level g size a cage code 67268 5962- 95813 sheet 1 of 2 8 dscc form 2233 apr 97 5962- e 143- 12
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents three product assurance class levels consisting of high reliability (device class q), space application (device class v) and for appropriate satellite and similar applications (device class t). a choice of case outli nes and lead finishes are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance (rha) levels is reflected in the pin. for device class t, the user is encouraged to review the manufacturer?s quali ty management (qm) plan as part of their evaluation of these parts and their acceptability in the intended application. 1.2 pin . the pin is as shown in the following example: 5962 r 95813 01 v c c federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \ / drawing number 1.2.1 rha designator . device classes q, t and v rha marked devices meet the mil - prf - 38535 specified rha levels and are marked with the appropriate rha designator. a dash ( - ) indicates a non- rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 hs303rh radiation hardened di, dual spdt cmos switch 02 hs307rh radiation hardened di, dual spdt cmos switch 03 hs390rh radiation hardened di, dual spdt cmos switch 04 hs303arh radiation hardened di, dual spdt bi cmos switch 05 hs303brh radiation hardened di, dual spdt bi cmos switch 06 hs303aeh radiation hardened di, dual spdt bi cmos switch 07 hs303beh radiation hardened di, dual spdt bi cmos switch 08 hs303ceh radiation hardened di, dual spdt bi cmos switch 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation q, v certification and qua lification to mil - prf -38535 t certification and qualification to mil - prf - 38535 with performance as specified in the device manufacturers approved quality management plan.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 3 dscc form 2234 apr 97 1.2.4 case outline(s) . the case outline(s) are as designated in mil - std - 1835 and as follows: outline letter descriptive designator terminals package style c cdip2 - t14 14 dual -in - line e cdip2 - t16 16 dual -in - line x cdfp3 - f14 14 flat package y cdfp4 - f16 16 flat package 1.2.5 lead finish . the lead finish is as speci fied in mil - prf - 38535 for device classes q, t and v . 1.3 absolute maximum ratings . 1 / supply voltage between +v and -v : device types 01, 02, 03 ..................................................................................... 44 v device types 04 , 05, 06, 07, and 08 .................................................................... 35 v supply voltage between +v and ground : device types 01, 02, 03 ..................................................................................... 22 v device types 04 , 05, 06, 07, and 08 .................................................................... 17.5 v supply voltage between - v and ground : device types 01, 02, 03 ..................................................................................... -22 v device types 04 , 05, 06, 07, and 08 .................................................................... - 17.5 v digital input overvoltage : +v a ....................................................................................................................... +v supply + 4 v -v a ........................................................................................................................ -v su pply - 4 v analog input overvoltage : +v s ....................................................................................................................... +v supply + 1.5 v -v s ........................................................................................................................ -v supply - 1.5 v continuous current, s or d ....................................................................................... 10 ma peak current, s or d (pulsed at 1 ms, 10 percent duty cycle max) ......................................................... 40 ma storage temperature range ....................................................................................... -65
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 4 dscc form 2234 apr 97 1.4 recommended operating conditions . operating supply voltage ( > mil - prf -38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil - std -883 - test method standard microcircuits. mil - std -1835 - interface standard electronic component case outlines. department of defense handbooks mil - hdbk -103 - list of standard microcircuit drawings. mil - hdbk -780 - standard microcircuit drawings. (co pies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111 - 5094.) _ __ ___ 3 / device types 01, 02, and 03 radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in mil - std - 883, method 1019, condition a to a maximum total dose of 100 k rad s (si) . 4 / device types 04 and 05 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. the radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in mil - std - 883, method 1019, condition a to a maximum total dose of 300 k rad s (si) . 5 / device types 06 and 07 radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in mil - std - 883, method 1019, condition a to a maximum total dose of 300 k rad s (si) and condition d to a maximum total dose of 50 k rad s (si). 6 / device type 08 radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in mil - std - 883, method 1019, condition a to a maximum total dose of 1 00 krads(si) and condition d to a maximum total dose of 50 krads(si). 7 / devices use dielectrically isolated (di) technology and latch up is physically not possible.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 5 dscc form 2234 apr 97 2.2 order of precedence . i n the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item requirements for device classes q, t and v shall be in accordance with mil - prf -38535 as specified herein , or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect th e form, fit, or function as described herein. 3.1.1 microcircuit die . for the requirements of microcircuit die, see appendix a to this document. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions sh all be as specified in mil - prf - 38535 and herein for device classes q, t and v . 3.2.1 case outlines . the case outlines shall be in accordance with 1.2.4 herein. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 1. 3.2.3 truth table . the truth table shall be as specified on figure 2. 3.2.4 timing diagrams . the timing diagrams shall be as specified on figure 3. 3.2.5 radiation exposure circuit . the radiation exposure circuit shall be maintained by the manu facturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 electrical performance characteristics and postirradiation parameter limits . unless otherwise specified herein, the ele ctrical performance characteristics and postirradiation parameter limits are as specified in table i and shall apply over the full ambient operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii a . the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's pin may also be marked. for packages where mark ing of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962 - " on the device. for rha product using this option, the rha designator shall still be marked. marking for device classes q , t and v shall be in accordance with mil - prf - 38535. 3.5.1 certification/compliance mark . the certification mark for device classes q, t and v shall be a "qml" or "q" as required in mil - prf - 38535. 3.6 certificate of compliance . for device class es q, t and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). the certificate of compliance submitted to dla land and maritime - va prior to list ing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes q, t and v, the requirements of mil - prf - 38535 and herein. 3.7 certificate of conformance . a certificate of conformance as requir ed for device classes q, t and v in mil - prf - 38535 appendix a shall be provided with each lot of microcircuits delivered to this drawing.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions 1 / -55 ?
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 7 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 8 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 9 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 10 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 11 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 12 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55 ? ? ? ? ? ? ? ?
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 13 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions 1 / -55 ? ? ? ?
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 14 dscc form 2234 apr 97 case outlines c and x e and y device types 01, 02 04, 05, 06, 07 , and 0 8 03 terminal number terminal symbol 1 nc d1 2 s3 nc 3 d3 d3 4 d1 s3 5 s1 s4 6 in1 d4 7 gnd nc 8 v- d2 9 in2 s2 10 s2 in2 11 d2 v+ 12 d4 nc 13 s4 gnd 14 v+ v- 15 --- in1 16 --- s1 nc = no connections figure 1. terminal connections . logic sw1 sw3 sw2 sw4 0 off on 1 on off figure 2. truth table .
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 15 dscc form 2234 apr 97 switching test circuit note: for device types 01, 03, 04, 05, 06, 07, and 08 , v inh = +4 v. for device type 02, v inh = +15 v. for device types 01, 02, 03, 04, 06, and 0 8 , v - = - 15 v and v+ = +15 v. for device type s 05 and 07, v - = - 12 v
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 16 dscc form 2234 apr 97 break - before- make test circuit note: for device types 01, 03, 04, 05, 06, 07, and 0 8 , v inh = +5 v. for device type 02, v inh = +15 v. for device types 01, 02, 03, 04, 06, and 0 8 , v - = - 15 v and v+ = +15 v. for device type s 05 and 07 , v - = - 12 v
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 17 dscc form 2234 apr 97 4. verification 4.1 sampling and inspection . for device classes q, and v, sampling and inspection procedures shall b e in accordance with mil - prf - 38535 or as modified in the device manufacturer's quality management (qm) plan, including screening (4.2), qualification (4.3), and conformance inspection (4.4). the modification in the qm plan shall not affect the form, fit, or function as described herein. for device class t, sampling and inspection procedures shall be in accordance with mil - prf - 38535 and the device manufacturer?s qm plan including screening, qualification, and conformance inspection. the performance envelo pe and reliability information shall be as specified in the manufacturer?s qm plan. 4.2 screening . for device classes q and v, screening shall be in accordance with mil - prf - 38535, and shall be conducted on all devices prior to qualification and techn ology conformance inspection. for device class t, screening shall be in accordance with the device manufacturer?s quality management (qm) plan, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2. 1 additional criteria for device classes q, t and v . a. the burn - in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the burn- in test c ircuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circui t shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil - std -883. b. for device classes q, t and v interim and final electrical test parameters shall be as specified i n table ii a herein. c. additional screening for device class v beyond the requirements of device class q shall be as specified in mil - prf - 38535, a ppendix b. 4.3 qualification inspection for device classes q, t and v . qualification inspection for dev ice classes q and v shall be in accordance with mil - prf - 38535. qualification inspection for device class t shall be in accordance with the device manufacturer?s quality management (qm) plan. inspections to be performed shall be those specified in mil - prf - 38535 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil - prf -38535 including groups a, b, c, d, and e inspec tions , and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mil - std - 883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). technology conformance inspection for cla ss t shall be in accordance with the device manufacturer?s quality management (qm) plan. 4.4.1 group a inspection . a. tests shall be as specified in table iia herein. b. subgroups 5, 6, 7, and 8 in table i, method 5005 of mil - std - 883 shall be omitted. c. subgroup 4 (c c1 , c c2 , c os , and c is measurements) should be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. 4.4.2 group c inspection . the group c inspection end - point electrical parameters shall be as specified in table iia herein. 4.4.2.2 additional criteria for device classes q, t and v . the steady - state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the test circuit shall be maintained under document revisio n level control by the device manufacturer's trb in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applic able, in accordance with the intent specified in method 1005 of mil - std -883.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 18 dscc form 2234 apr 97 table iia. electrical test requirements . test requirements subgroups (in accordance with mil - prf - 38535, table iii) device class q device class v device class t interim electrical parameters (see 4.2) 1,9 1,9 as specified in qm plan final electrical parameters (see 4.2) 1,2,3,9, 1 / 10,11 1,2,3, 1 / 2 / 9,10,11, ? ?
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 19 dscc form 2234 apr 97 table iib. burn - in delta parameters and group c delta parameters (+25 ? ? ? ?
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 20 dscc form 2234 apr 97 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil - prf - 38535 for device classes q, t and v . 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of recor d for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform dla land and maritime when a system application requires configura tion control and which smd's are applicable to that system. dla land and maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectro nic devices (fsc 5962) should contact dla land and maritime - va, telephone (614) 692 - 8108 . 6.4 comments . comments on this drawing should be directed to dla land and maritime - va , columbus, ohio 43218- 3990, or telephone (614) 692 - 054 0 . 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defin ed in mil - prf - 38535 and mil- hdbk -1331. 6.6 sources of supply . 6.6.1 sources of supply for device classes q, t and v . sources of supply for device classes q, t and v are listed in mil - hdbk -103 and qml - 38535. the vendors listed in qml - 38535 have submitted a certific ate of compliance (see 3.6 herein) to dla land and maritime - va and have agreed to this drawing.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 21 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 a.1 scope a.1.1 scope . this appendix establishes minimum requirements for microcircuit die to be supplied under the qualified manufacturers list (qml) program. qml microcircuit die meeting the requirements of mil - prf - 38535 and the manufacturers approved qm plan for use in mo nolithic microcircuits, multi - chip modules (mcms), hybrids, electronic modules, or devices using chip and wire designs in accordance with mil - prf - 38534 are specified herein. two product assurance classes consisting of military high reliability (device cla ss q) and space application (device class v) are reflected in the part or identification number (pin). when available, a choice of radiation hardiness assurance (rha) levels are reflected in the pin. a.1.2 pin . the pin is as shown in the following example: 5962 f 95813 0 4 v 9 a federal stock class designator rha designator (see a.1.2.1) device type (see a.1.2.2) device class designator die code die details (see a.1.2.4) \ / (see a.1.2.3) \ / drawing number a.1.2.1 rha designator . device classes q and v rha identified die meet the mil - prf - 38535 specified rha levels. a dash (- ) indicates a non- rha die. a.1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit func tion 01 hs - 303rh radiation hardened di , dual spst cmos switch 02 hs - 307rh radiation hardened di , dual spst cmos switch 03 hs - 393rh radiation hardened di , dual spst cmos switch 04 hs - 303arh radiation hardened di , dual spst bi cmos switch 05 hs -303 brh radiation hardened di , dual spst bi cmos switch 06 hs303aeh radiation hardened di, dual spdt bi cmos switch 07 hs303beh radiation hardened di, dual spdt bi cmos switch 08 hs303ceh radiation hardened di, dual spdt bi cmos switch a.1.2.3 device class designator . device class device requirements documentation q or v certification and qualification to the die requirements of mil - prf -38535
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 22 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 a.1.2.4 die details . the die details designa tion is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each pro duct and variant supplied to this appendix. a.1.2.4.1 die physical dimensions . die type figure number 01, 04, 05 , 06, 07 a-1 02 a-2 03 a-3 08 a-4 a.1.2.4.2 die bonding pad locations and electrical functions . die type figure number 01, 04, 05, 06, 07 a-1 02 a-2 03 a-3 08 a-4 a.1.2.4.3 interface materials . die type figure number 01, 04, 05, 06, 07 a-1 02 a-2 03 a-3 08 a-4 a.1.2.4.4 assembly related information . die type figure number 01, 04, 05, 06, 07 a-1 02 a-2 03 a-3 08 a-4 a.1.3 absolute maximum ratings . see paragraph 1.3 herein for details. a.1.4 recommended operating conditions . see paragraph 1.4 herein for details. a.1.5 radiation features . see paragraph 1.5 herein for details.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 23 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 a.2 applicable documents. a.2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. department of defense specification mil - prf -38535 - integrated circuits, manufacturing, general specification for. department of defense standard mil - std -883 - test method standard microcircuits. department of defense handbooks mil - hdbk -103 - list of standard microcircuit drawings. mil - hdbk -780 - standard microcircuit drawings. (copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111 - 5094.) a.2.2 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. a.3 requirements a.3.1 item requirements . the individual item requirements for device classes q and v shall be in accordance with mil - prf - 38535 and as specified herein or as modified in the device manufacturer?s quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. a.3.2 design, construction and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil - prf - 38535 and herein an d the manufacturer?s qm plan for device classes q and v. a.3.2.1 die physical dimensions . the die physical dimensions shall be as specified in a.1.2.4.1 and on figure s a-1 , a - 2, a - 3, and a-4 . a.3.2.2 die bonding pad locations and electrical functions . the die bonding pad locations and electrical functions shall be as specified in a.1.2.4.2 and on figures a - 1, a - 2, a - 3, and a- 4 . a.3.2.3 interface materials . the interface materials for the die shall be as specified in a.1.2.4.3 and on figures a - 1, a - 2, a - 3, and a-4 . a.3.2.4 assembly related information . the assembly related information shall be as specified in a.1.2.4.4 and on figures a - 1, a- 2, a - 3, and a-4 . a.3.2.5 truth table . the truth table shall be as defined in paragraph 3. 2 . 3 herein. a.3 .2.6 radiation exposure circuit . the radiation exposure circuit shall be as defined in paragraph 3. 2 . 5 herein. a.3.3 electrical performance characteristics and post - irradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and post - irradiation parameter limits are as specified in table i of the body of this document. a.3.4 electrical test requirements . the wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table i.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 24 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 a.3.5 marking . as a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer?s identification and the pi n listed in a.1.2 herein. the certification mark shall be a ?qml? or ?q? as required by mil - prf -38535. a.3.6 certification of compliance . for device classes q and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see a.6.4 herein). the certificate of compliance submitte d to dla land and maritime - va prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer?s product meets, for device classes q and v, the requirements of mil - prf - 38535 and the requirements herein. a.3.7 certifi cate of conformance . a certificate of conformance as required for device classes q and v in mil - prf - 38535 shall be provided with each lot of microcircuit die delivered to this drawing. a.4 verification a.4.1 sampling and inspection . for device classe s q and v, die sampling and inspection procedures shall be in accordance with mil - prf - 38535 or as modified in the device manufacturer?s quality management (qm) plan. the modifications in the qm plan shall not affect the form, fit, or function as described herein. a.4.2 screening . for device classes q and v, screening shall be in accordance with mil - prf - 38535, and as defined in the manufacturer?s qm plan. as a minimum, it shall consist of: a. wafer lot acceptance for class v product using the criteria defined in mil - std - 883, method 5007. b. 100% wafer probe (see paragraph a.3.4 herein). c. 100% internal visual inspection to the applicable class q or v criteria defined in mil - std - 883, method 2010 or the alternate procedures allowed in mil - std - 883, me thod 5004. a.4.3 conformance inspection . a.4.3.1 group e inspection . group e inspection is required only for parts intended to be identified as radiation assured (see a.3.5 herein). rha levels for device classes q and v shall be as specified in mil - prf - 38535. end point electrical testing of packaged die shall be as specified in table ii herein. group e tests and conditions are as specified in paragraphs 4.4.4 , 4.4.4.1, 4.4.4.2, and 4.4.4.2.1 herein. a.5 die carrier a.5.1 die carrier require ments . the requirements for the die carrier shall be accordance with the manufacturer?s qm plan or as specified in the purchase order by the acquiring activity. the die carrier shall provide adequate physical, mechanical an d electrostatic protection. a. 6 notes a.6.1 intended use . microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with mil - prf - 38535 or mil- prf - 38534 for government microcircuit applications (original equipment), design applications, an d logistics purposes. a.6.2 comments . comments on this appendix should be directed to dla land and maritime - va, columbus, ohio, 43218- 3990 or telephone (614) -692- 0540. a.6.3 abbreviations, symbols, and definitions . the abbreviations, symbols, and d efinitions used herein are defined in mil - prf - 38535 and mil- hdbk -1331. a.6.4 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in qml - 38535. the vendors listed within qml - 38535 have submitted a certifi cate of compliance (see a.3.6 herein) to dla land and maritime - va and have agreed to this drawing.
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 25 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 device types 01, 02 note: pad numbers reflect terminal numbers when placed in case outlines c and x (see figure 1). die physical dimensions. die size: 1930 microns x 2130 microns. die thickness: 11
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 26 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 device type 03 note: pad numbers reflect terminal numbers when placed in case outlines e and y (see figure 1). die physical dimensions. die size: 2130 microns x 1930 microns. die thickness: 11
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 27 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 device types 04 , 05, 06, and 0 7 note: pad numbers reflect terminal numbers when placed in case outlines c and x (see figure 1). die physical dimensions. die size: 2690 microns x 5200 microns. die thickness: 19
standard microcircuit drawing size a 5962- 95813 dla land and maritime columbus, ohio 43218 - 3990 revision level g sheet 28 dscc form 2234 apr 97 appendix a appendix a forms a part of smd 5962 -95813 device type 08 note: pad numbers reflect terminal numbers when placed in case outlines c and x (see figure 1). die physical dimensions. die size: 2815 microns x 5325 microns. die thickness: 19
standard microcircuit drawing bulletin date: 13-03-22 approved sources of supply for smd 5962 -95813 are listed below for immediate acquisition information only and shall be added to mil - hdbk - 103 and qml- 38535 during the next revision. mil- hdbk - 103 and qml- 38535 will be revised to include the addition or deletion of sources. the vendors listed below ha ve agreed to this drawing and a certificate of compliance has been submitted to and accepted by dla land and maritime - va. this information bulletin is superseded by the next dated revision of mil - hdbk - 103 and qml-38535. dla land and maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962r9581301qcc 3 / hs1 - 303rh -8 5962r9581301qxc 3 / hs9 - 303rh -8 5962r9581301tcc 3 / hs1 - 303rh -t 5962r9581301txc 3 / hs9 - 303rh -t 5962r9581301vcc 3 / hs1 - 303rh -q 5962r9581301vxc 3 / hs9 - 303rh -q 5962r9581301v9a 3 / hs0 - 303rh -q 5962r9581302qcc 3 / hs1 - 307rh -8 5962r9581302qxc 3 / hs9 - 307rh -8 5962r9581302vcc 3 / hs1 - 307rh -q 5962r9581302vxc 34371 hs9 - 307rh -q 5962r9581302v9a 34371 hs0 - 307rh -q 5962r9581303qec 3 / hs1 - 390rh -8 5962r9581303qyc 3 / hs9 - 390rh -8 5962r9581303tec 3 / hs1 - 390rh -t 5962r9581303tyc 3 / hs9 - 390rh -t 5962r9581303vec 3 / hs1 - 390rh -q 5962r9581303vyc 3 / hs9 - 390rh -q 5962r9581303v9a 3 / hs0 - 390rh -q 5962f9581304qcc 34371 hs1 - 303arh -8 5962f9581304qxc 34371 hs9 - 303arh -8 5962f9581304vcc 34371 hs1 - 303arh -q 5962f9581304vxc 34371 hs9 - 303arh -q 5962f9581304v9a 34371 hs0 - 303arh -q 1 of 2
standard microcircuit drawing bulletin - continued date: 13 -03-22 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962f9581305qcc 34371 hs1 - 303brh -8 5962f9581305qxc 34371 hs9 - 303brh -8 5962f9581305vcc 34371 hs1 - 303brh -q 5962f9581305vxc 34371 hs9 - 303brh -q 5962f9581305v9a 34371 hs0 - 303brh -q 5962f9581306vcc 34371 hs1 - 303aeh -q 5962f9581306vxc 34371 hs9 - 303aeh -q 5962f9581306v9a 34371 hs0 - 303aeh -q 5962f9581307vcc 34371 hs1 - 303beh -q 5962f9581307vxc 34371 hs9 - 303beh -q 5962f9581307v9a 34371 hs0 - 303beh -q 5962r 9581308vxc 34371 hs9 - 303ceh -q 5962r 9581308v9a 34371 hs0 - 303ceh -q 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acqui red to this number may not satisfy the performance requirements of this drawing. 3 / not available from an approved source of supply. vendor cage vendor name number and address 34371 intersil corporation 1001 murphy ranch road milpitas, ca 95035 - 6803 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2

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